Management Team

Founder
Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany

Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME)

Board of Directors, Surface Mount Technology Association (SMTA)

ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division

Outstanding Research Award, National Science Foundation, Packaging Research Center

Tim Sparks

Vice President, Operations and Founder
Industrial Engineering, Purdue University

Tim has been involved with Microelectronic Packaging for over 12 years, primarily in Engineering Management. His focus has been on Semiconductor and Optoelectronic Packaging for the past five years. The primary assembly technologies include Die Attach (eutectic and epoxy), wirebonding (ball, wedge, and ribbon), and SMT. Package assembly has been performed with a variety of substrate technologies including High Performance Organics, Ceramics, Silicon, and Glass.

Tim also has extensive experience with Operational Logistics in high technology assembly systems. The expectation in leading edge technologies is change. “Time to market with high quality is the backbone for all operations. Flexible management control systems allow for rapid changeover and dynamic scheduling, therefore systems are structured around change, rather than conventional systems.” This combination is necessary to meet the demands of today’s rapidly changing technology market. His background in Contract Manufacturing for Leading Edge Products is an ideal fit for Engent’s environment.

Vice President Sales and Founder
MBA, Duke University
BS, Mechanical Engineering, Purdue University

Prior to the creation of Engent, Matt was part of the Siemens team as a business development manager for nearly three years. His prior work experience has been focused within the electronics industry for the past seven years. His industry experience includes capital equipment sales as well as R&D program management. Matt's previous work experience as the Program Manager for the Center for Board Assembly Research center at the Georgia Institute of Technology has allowed him to understand the demands of new technology and how to efficiently translate them into commercially viable products.