Services
Engent provides a variety of services that allow its customers to launch new products and technologies effectively. All of these services allow Engent to support our customers well beyond the need to just assemble their products. The Engent approach is to provide a suite of services that compliment our next generation manufacturing capabilities and allows the customer to ensure quick time to market with the most robust and reliable product.
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Wafer Services
- Wafer saw, sort, and inspect
- Wafer Thinning
- Wafer Bumping
- Die Banking
- Known Good Die
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Commercialization of New and Emerging Technologies
- Advanced Process Development
- Advanced Technology Component Prototyping
- Materials Analysis and Characterization
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Reliability Testing
- New Package and Assembly Qualification (Level I and II)
- Product-Level Testing
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Failure Analysis Capabilities
- Analytical Failure Analysis
- Materials Characterization and Analysis
- Consulting
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