Services
Our focus is the production solution for your next generation electronics product. Engent provides a variety of services that allow its customers to launch new products and technologies into production effectively. All of these services support our customers well beyond the need to just assemble their products. The Engent approach is to provide a suite of services that are necessary for high yielding production and which allows our customer quick time to market with the most robust and reliable product.
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Wafer Services
- Wafer saw, sort, and inspect
- Wafer Thinning
- Wafer Bumping
- Die Banking
- Known Good Die
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Commercialization of New and Emerging Technologies
- Advanced Process Development
- Advanced Technology Component Prototyping
- Materials Analysis and Characterization
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Reliability Testing
- New Package and Assembly Qualification (Level I and II)
- Product-Level Testing
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Failure Analysis Capabilities
- Analytical Failure Analysis
- Materials Characterization and Analysis
- Consulting
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