AAT Success Story
When an OEM needed very quick-turn assembly of a new board using consigned material, they found that their EMS provider’s high-volume lines were running with no open capacity.
AAT Solution:
Engent set up, assembled and delivered the boards - ahead of schedule. Of more significance is the early determination during first article inspection of a thin HASL finish on the boards, which would have resulted in poor solderability. New boards were obtained and the total solution of process knowledge, capability, and customer support allowed this product to be delivered on time.
Our Process
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Past Projects
- Miniaturized PC
Communication Card
Prototyping (CSP, 0201,
0402, BGA)
- Lead Free CSP
Qualification Boards
- High Density Flexible High Density Flexible
Substrate Tape Ball Grid Array
Flip Chip Package
- MEMS Optical Cross Connect
Switch Package Assembly
Prototyping
- Prototyping Miniaturized
Product Containing 0201s
- Broadband Video on Demand
Product Prototyping
- Broadband Wireless Product
Prototyping Prototyping
- Flip Chip Hearing Aid
Prototyping Using No Flow
Underfills
- High Density Microvia Scanner
Module Prototyping
- Flip Chip in Package Process
Development and Transfer
Using No Flow Underfills
- Lead Free, Halogen Free
Bluetooth Module Process
Development and Prototyping
- High Frequency Chip and Wire
Module Assembly with
GaAs Die
- High Speed Optoelectronic
Module Assembly with High
Accuracy laser die attach and
ribbon bonding
- Flip Chip on Flex
Optoelectronic Transceiver
Module Assembly
- High Frequency Chip and
Wire Module Assembly with
GaAs Die
- Eutectic die bonding on
optoelectronic silicon bench
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