Process Capabilities

Advanced Packaging



• 3D Die to Wafer Packaging
• Wafer Level Packaging
• System in Package (SIP)
• Multi-Chip Module Packaging
• Chip to Chip Wire Bonding
• Integrated SIP-SMT Processing
• Stacked IC Packaging
• Bare Die Handling (Si, SiGe, GaAs, InP, Lithium*)
• Substrates (AlN, LTCC, HTCC, Thermount®, BT, FR-5, Polyimide, Metal Core, etc)
• Wire Bonding
  • Gold Ball Bonding
  • Wedge Bonding
  • Ribbon Bonding
• High Precision Die Attach
  • Epoxy
  • Eutectic
• BGA Packaging
• CSP Packaging
• Gallium Alloy Interconnects, Conductors and Bonding (Flip Chip, Optical Fiber Bonding, Via Filling)
• Liquid encapsulation (Glob top, Dam and Fill)
• Solder Balling and Ball Placement
• BGA and CSP Re-Balling




Flip Chip Technology



• Flip chip assembly on
  • Ceramic
  • Glass
  • Polymer
  • Tape
  • Organic substrates
• Flip Chip on Flex
• Flip Chip in Module
• Stacked Die Flip Chip
• Fluxless Flip Chip Soldering
• Advanced Underfills Processing - Jetting
  • No Flow Underfills and Reflowable Encapsulants
  • Fast Flow Snap Cure
  • High Performance
  • Reworkable
  • UV Curable
  • Small gap underfill capabilities
• Qualified Flux, Underfill, and Substrate Systems
• No Flow Underfills Assembly Processing
• Cu Wire Stud Bumping of ICs
• Gold wire stud bumping of ICs
• ICF/ACP Flip Chip
• Compression Bonding Flip Chip
• Flip Chip Rework System




Optoelectronic and MEMS Packaging



• Passive
• Low Temperature Si Bonding
• Passive Alignment
  • Automated
  • Interconnect
• MEMS Packaging
  • Optical
  • Micro-Relays
  • Pressure Sensors
• Wafer Level Packaging
• Through Wafer Conductive Vias
• Fluxless Flip Chip Soldering
• Solder Ball Placement and Processing
• Spherical Lens Placement and Bonding
• Selective Laser Soldering
• Silicon Cap Placement and Bonding




Surface Mount Processing



• Standard SMT Components (all types)
• Lead Free Solder Processing
• High Speed 01005, 0201, 0402, 0603, 0805, … Processing
• BGA Processing
• Fine Pitch BGA Processing
• Advanced Area Array Package Processing
  • CBGA
  • CCGA
  • HBGA
  • Double Sided BGAs
  • Mirror Image BGAs
• CSP, mBGA, and Wafer Level CSP Processing
• Fine Pitch CSP Processing down to 0.3mm
• Reworkable Underfill Processing BGAs/CSPs
• Fluxless Reflow Soldering
• Fine Pitch Stencil Printing
• Flip Chip on Board Processing
• Pin-Through Hole Processing
• Through Hole Connector Rework System
• BGA/CSP/Area Array Package Rework Systems




Through Hole Assembly



• Pin-Through Hole Processing
• Odd Form Placement
• High Quality Hand Soldering




Testing and Inspection



• X-Ray Inspection
• Post Printing 3-D Solder Paste Inspection
• CSAM inspection of underfill for voiding