Our Technologies
Engent has provided a combination of engineering consulting, process development, prototyping, environmental testing, failure analysis, and production services for the Technologies below. We have partnered with both industry and academics to advance the state-of-the-art in electronics manufacturing. Engent continues to push the envelope with emerging Technologies and will continue to add to the list of Technologies shown below.
Advanced SMT Assembly
- Flip Chip
- Direct Chip Attach & Chip on Board (COB)
- 0201 through 55 mm BGA Processing
- Adv. Area Array Packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
- Chip Scale Package (CSP) Assembly
- Wafer Scale CSP Assembly
- Lead-free Solder
- Optoelectronics Assembly
- Fiber Splicing
- High-Density Large Panel Assembly
Advanced Packaging and Module Assembly
- System-in-Package
- MEMS Packaging
- Optoelectronics Packaging
- Solder Balling and Replacement
- Stacked IC Packaging
- Flip Chip Packaging
- Fluxless Reflow Soldering
Integrated Wire Bonding and Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- Ball Bonding
- Wedge Bonding
- Ribbon Bonding
- Chip to Chip Bonding
Materials Processing and Analysis
- Re-workable and No-Flow Underfills
- Flux-Underfill Qualification & Analysis
- Adhesive Printing
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