Our Technologies
Engent's focus is to proivde production solutions for your next gerneration electronics product. Engent provides a combination of upfront engineering consulting, process development, prototyping, environmental testing, and failure analysis, to support the production services we provide for the Technologies below. We have partnered with both industry and academics to advance the state-of-the-art in electronics manufacturing. Engent continues to push the envelope with emerging Technologies and will continue to add to the list of Technologies shown below.
Advanced SMT Assembly
- Flip Chip
- Direct Chip Attach & Chip on Board (COB)
- 01005, 0201 through 55 mm BGA Processing
- Adv. Area Array Packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA)
- Chip Scale Package (CSP) Assembly
- 0.3mm - 0.5mm Wafer Scale CSP (WLCSP)Assembly
- Lead-free Solder
- Optoelectronics Assembly
- Fiber Splicing
- High-Density Large Panel Assembly
3D Packaging & Assembly
- Die to Wafer 3D assembly
- TSV Interposer assembly
- Die and SMT onto silicon interposer assembly
Advanced Packaging and Module Assembly
- System-in-Package
- MEMS Packaging
- Optoelectronics Packaging
- Gold Stud bump bonding for Flip Chip
- Solder Balling and Replacement
- Stacked IC Packaging
- Flip Chip Packaging
- Fluxless Reflow Soldering
Integrated Wire Bonding and Die Bonding
- Eutectic Die Bonding
- Epoxy Die Bonding
- Ball Bonding
- Wedge Bonding
- Ribbon Bonding
- Chip to Chip Bonding
Materials Processing and Analysis
- Re-workable and No-Flow Underfills
- Flux-Underfill Qualification & Analysis
- Adhesive Printing
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