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Engent Announces its Lead Free Deployment Solutions ProgramAtlanta, Georgia, USA October 1st, 2003— Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products has been considered an environmental issue and is beginning a “phase out” in different parts of the world. Japan is leading the way with major Japanese corporations committing to eliminate the use of lead in electronic products by 2005. In addition, the European Union has set legislation into motion that mandates the use of lead-free materials in all electronic and other products by July 2006. The elimination of lead in electronic products will require new materials and processes to be put into use. Engent will be partnering with multi-national and regional OEMs, EMS Providers and materials suppliers to study the properties and processing of new materials that do not contain lead and deliver a solution to these emerging mandates. “Our solutions approach allows the costs of development to be spread over a larger group of companies who can all benefit in the results,” says Dr. Daniel F. Baldwin, President of Engent. Phil Zarrow, President of ITM Consulting said, “Engent has the right resources, facilities and know-how to develop robust processes that will be required for lead free assemblies”. Engent’s program defines a complete lead-free process including design considerations, solder paste, printing, placement and reflow process procedures as well as the deployment of the process technology around the world. Engent is currently seeking additional partners to participate in this study and share in the overall results. Click Here to Launch Lead Free Proposal For more information about Engent, Inc, please contact us at:
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