News and Press Releases

April 7th, 2008

Engent Receives ISO 9001:2000 Certification

Norcross, GA. –Engent, Inc. received its ISO 9001:2000 certification through Underwriters Laboratories Inc. on February 22, 2008. ISO 9001:2000 is recognized worldwide as the standard for quality management systems. Engent’s quality management system was approved for the manufacturing of electronic and micro-electronic assemblies and packages.

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May 23rd, 2006

FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies

PHOENIX, ARIZONA May 23rd, 2006-FlipChip International and Engent today announced a strategic alliance aimed at accelerating the development and deployment of 3D Wafer Level CSP (WLCSP)Technologies for highly integrated stacked die packaging applications. This technology has the possibility of enabling packaging solutions that are quicker to market and lower cost than System-On-Chip alternatives. Engent is a prominent leader in 3D flip chip assembly and FlipChip International is the world’s leading wafer level bumping company.

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May 16th, 2006

Flip Chip Presentation Draws Local IMAPS and SMTA Members

BOXBOROUGH, MA - For the second time this year, SMTA Boston and IMAPS New England members shared ideas and information over dinner in a joint meeting and presentation, held March 21, 2006, at the Holiday Inn Boxborough Woods. The evening’s program included a presentation titled “Flip Chip Technology - What, Why, and How?” by Daniel Baldwin, Ph.D., Professor of Mechanical Engineering at the Georgia Institute of Technology, and co-founder of Engent, provider of advanced electronic manufacturing and technology services. Baldwin also serves on Advanced Packaging’s Editorial Advisory Board.

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January 2004

SMT Magazine Q&A :: World-class manufacturing

As the manufacturing sector continues to recover and orders continue to grow, claims about world-class manufacturing are ever present in the industry. Dr. Baldwin describes the key differentiators of a world-class manufacturer.

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October 1st, 2003

Engent Announces its Lead Free Deployment Solutions Program

Engent, Inc. has announced the creation of its Lead Free Deployment Solutions Program. The use of lead in electronics products has been considered an environmental issue and is beginning a “phase out” in different parts of the world.

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September 19, 2003

SMT Magazine :: Q & A

Daniel F. Baldwin, president of Engent Inc., answers questions about the advantages of a Design for Manufacturing (DFM) environment and automating the process to ensure high-yield volume manufacturing.

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June 30, 2003

SMT Magazine :: Q & A

Daniel F. Baldwin, president of Engent Inc., answers questions about the implementation challenges of Lead-free solder in Flip Chip and CSP Applications.

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June 10, 2003

IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead Free Solder

IPC—Association Connecting Electronics Industries® announced today that its Solder Products Value Council (SPVC) has begun a comprehensive study of the three leading lead free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead free assembly.

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April 17, 2003

Engent Acquires Rights to Siemens Dematic Advanced Assembly Technology Center

Engent, Inc. and Siemens Dematic Electronics Assembly Systems, Inc. (EAS) have signed an agreement for Engent to assume the rights to the Advanced Assembly Technology (AAT) Center contracts, equipment and personnel located in Norcross, Georgia. Additionally, Engent will become a member of the newly formed Siemens Dematic Technology Network, and the two companies will work closely together to provide advanced technology solutions to the electronics industry.

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