Chip on board (COB) assembly or packaging is a semiconductor assembly technology meant to eliminate conventional device packaging. Assembly directly mounts the microchip or die, connecting it to the circuit board with die-attach adhesive and curing with heat or ultra-violet light. Our expert engineers then complete the wirebonding process to protect against chemical and mechanical damage.
Engent also offers several other circuit board and advanced SMT assembly services, including:
Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.
Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.