Manufacturing Services

Electronic Manufacturing Services (EMS)

Engent’s EMS expertise is designed to enable high volume manufacturing while shortening time to market. The suite of services we provide ensures high-yield production of the industry’s most robust and reliable products available on the market. Our EMS expertise includes design, engineering, manufacturing, as well as electronic component testing and OEM assembly.

Our approach to manufacturing provides our clients with the flexibility to scale manufacturing to meet business needs, so materials, resources and expertise are only leveraged when necessary, resulting in higher efficiency and cost effective manufacturing models.

Engent’s electronic manufacturing services include:

  • Electronic Assembly Services
  • PCBA: Printed Circuit Board Assembly
  • Microelectronics Assembly
  • Next Generation Manufacturing
  • Electronic Failure Analysis

Electronic Assembly Services

PCBA: Printed Circuit Board Assembly

Microelectronics Assembly

Next Generation Manufacturing

Electronic Failure Analysis

  • All
  • Capabilities
  • Services
  • Technology Papers
  • Microelectronics Assembly
    Engent’s highly skilled technicians engineer printed circuit board assembly (PCBA) with the best soldering options on either single or double-sided circuit boards. Our capabilities include high volume...
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  • Technology Commercialization
    Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and testing to advance technology...
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  • Electronic Product Testing
    At Engent, we utilize state-of-the-art electronic product testing equipment that ensures maximum product reliability and performance. Our equipment is capable of testing for shock, vibration, temperature...
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  • Electronic Printed Circuit Board Prototyping
    Electronic printed circuit board (PCB) prototyping is a critical element within the development of a new printed circuit board design...
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  • Printed Circuit Board Assembly
    Engent’s highly skilled technicians engineer printed circuit board assembly (PCBA) with the best soldering options on either single or double-sided circuit boards. Our capabilities include high volume...
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  • Box Build Services
    At Engent, our turnkey box build services allow us to provide a complete solution that doesn’t stop at assembly. Our experienced manufacturing teams ensure enclosure fabrication, installation of sub...
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  • Electronic Failure Analysis
    Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent the recurrence of failure. Our services combine...
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  • Electronic Packaging Service
    Engent specializes in electronic packaging services, ensuring that every product and component we design, engineer and manufacture is appropriately packaged for optimal functionality and sustained...
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  • Electronic Components Manufacturing
    At Engent, our electronic components manufacturing services are guided by years of experience and innovation. We recognize that the technologies behind electronic component manufacturing services are...
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  • Integrated Circuit Packaging
    Integrated circuit packaging (IC packaging) provides secure casing for custom microelectronics, protecting circuits and electrical contact connections from corrosion or other abrasive physical d...
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  • Chip on Board Assembly and Packaging
    Chip on board (COB) assembly or packaging is a semiconductor assembly technology meant to eliminate conventional device packaging. Assembly directly mounts the microchip or die, connecting it to the...
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  • Wafer Processing
    Wafer processing is an important aspect of providing the capability to offer microelectronics assembly services. In order to provide die assembly, the die must be prepared in a format that is compatible...
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  • Implementation Of No-Flow Underfills On Chip Scale Packages
    Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics manufacturing industry.
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  • Processing And Reliability Of Flip Chip With Lead-Free Solders On Halogen-Free Microvia Substrates
    The focus of this research is to characterize and implement environmentally conscious low cost flip chip material systems and processing, using two lead-free-solder interconnect systems and microvia halogen-free substrate.
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  • Thermal Dissipation Analysis In Flip Chip On Board And Chip On Board Assemblies
    A first order chip-scale thermal design model is developed for flip chip assemblies exhibiting good agreement with the experimental measurements.
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  • Prediction Of Solder Interconnects Wetting And Experimental Evaluation
    A new analysis methodology to predict solder interconnect wetting is developed to reveal the causes of poor wetting during flip chip assembly and to provide solutions.
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