|
Lead Free Test Kit
This kit is being offered to support your internal requirements for development of a lead free process. Engent will provide you with a complete kit of boards, stencils, and parts for use in your process development efforts. The board has been designed as a double sided board with both SMT and Through Hole components.
Please contact us for pricing and availability of these kits
-
Used for:
- Process Technology Development and Qualification
- Process Technology Transfers
- Process Technology Evaluations
- DPM Runs
-
Standardized Pad Designs and Optimized Pad Spacing
-
Multiple Surface Finishes Available
- Immersion Sn
- Immersion Ag
- Cu-OSP
- ENIG
- HASL
-
Includes 0201s, 0402s fine pitch QFPs, TSOPs, Fine Pitch CSPs, BGAs and a mix of SMT/TH comp.
-
Panel Form Factors up to 18 x 18 inches
-
Fully Electrically Testable
-
Kit Includes
- 90 Boards
- Components
- Topside Paste Stencil
- Bottomside Adhesive Stencil
- Lead Free Components
Please contact Engent to discuss your specific requirements by filling out the form below and clicking SEND.
Matt Perry
Vice President of Sales and Marketing
Phone: +1-678-990-3320 ext. 224
Fax: +1-678-990-3324
E-Mail: matt.perry@engentaat.com
|
ENGENT, Inc.
3140 Northwoods Parkway
Suite 300A
Norcross, Georgia 30071 USA
|
|
