Engent Failure Analysis Services
Failure analysis is the process of identifying the root causes of failures and developing the measures to prevent the failures from recurring. In today’s competitive electronics market, failures within the component, circuit, board, and system, can be extremely expensive and occur for any number of multifaceted reasons. It is important to choose a vendor who not only has the right equipment but most importantly the qualified expertise and personnel.
Engent AAT is able to offer state-of-the-art failure analysis services by combining the most advanced technology with the expertise of the leading engineers in the industry with production and advanced technology experience. Our services are not only proven, but our experience spans the entire spectrum of components such as:
- Area Array Packages (BGAs, CSPs, Flip Chip)
- MEMS structures
- Hybrid micro-circuits
- Multi-chip modules
- Integrated circuits
- Discrete transistors and diodes
- Photonic devices such as VCSELs, laser diodes, LEDs
- Chip on Board
- RF, Microwave & SAW devices
Our proven process and expertise means the fastest possible turnaround time so that there is a minimum loss of down time. You also get the necessary documentation to ramp up your volumes quickly. Engaging Engent AAT as your partner is really quite simple. We will start with a phone consultation to discuss the problem in detail with you. Next, we will conduct an analysis to determine the root cause of the specific problem and provide you with an estimate of time and cost so that you know exactly what to expect. Once the estimate is approved, we will move quickly to perform the necessary work, generate a detailed report and then follow up with you on a conference call. It really is that simple. But don’t take our word for it, read our case studies or ask one of our many satisfied customers.
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Take a minute to browse our analytical and failure analysis equipment list before you read the case studies:
- Low Pressure SEM
- SEM Backscatter Detector
- Energy Disperse X-Ray Analysis
- High Magnification Polarizing Light/Dark Field Microscope
- Metallagraph
- Differential Contrast Microscope
- X-Ray Florescence Microscope
- Megapixel Digital Camera
- CSAM – Acoustic Microscopy
- IR Microscope
- 3D Surface Inspection System
- High Speed Digital Video Camera
- Digital Image Analysis Software
- Boroscope
- FT-IR
- Digital Scanning Calorimeter – DSC
- Rheometer
- Viscometer
- TGA – Thermo Gravimetric Analysis
- DMA – Dynamic Mechanical
- TMA – Thermo Mechanical Analysis
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