Events
-
IWLPC 2008
International Wafer Level Packaging Conference
October 13 - 16, 2008
Sna Jose, CA. USA
www.iwlpc.com/smtai
-
SMTAI 2008
Surface Mount Technology Association International
August 17 - 21, 2008
Orlando, Florida, USA
Tutorial Details:
T17 Advanced Flip Chip Technology and Processing
Dan Baldwin,Ph.D., Engent,Inc.
Monday, August 18
1:30pm – 5:00pm
What You Will Learn
Flip chip assembly technology is gaining increased acceptance in the electronics industry. Annual growth rates projected through the next decade are 40% or higher. While flip chip technology was developed over thirty years ago by IBM and has been in production on ceramic substrates, it has yet to achieve cost competitiveness with high volume semiconductor packaging and low cost surface mount technology. In order to achieve cost competitiveness, new and innovative material systems and process technologies are required.
This course will present advanced flip chip process technology focusing on first pass yield, throughput, and cost. The course includes extensive handouts covering advanced flip chip process technology and materials. Flip chip processing of solder interconnect systems, conductive adhesive interconnect systems, thermosonic interconnects, and thermocompression interconnects will be presented. In addition, key processing elements such as underfill processing, reliability, and failure analysis will be presented. The relationship between process induced defects and flip chip reliability will be discussed. A comprehensive process characterization, reliability analysis, and failure mode analysis will be presented.
Who Should Attend
Individuals associated with advanced surface mount assembly, bare die module assembly, and advanced electronics packaging are encouraged to attend, specifically, the following: managers, manufacturing, quality, design, and packaging engineers who are challenged to solve tomorrow’s process solutions and next generation packaging problems.
Topics Covered
Flip chip technology
Flip chip process fundamentals
Advanced flip chip process technologies
Flip chip processing with no flow underfill
3D wafer level flip chip processing
Flip chip processing based on fast flow snap cure underfills
Fluxless flip chip process technology
Lead-free solder flip chip processing
Flip chip processing with reworkable underfills
Conductive adhesive interconnect systems and processing
Flip chip process implementation
Reliability analysis and failure modes
www.smta.org/smtai
-
ECTC 2008
58th ECTC | Electronic Components and Technology Conference
May 27-30, 2008
Lake Buena Vista, Florida , USA
Paper Presented: 3D-WLCSP package technology – Processing and Reliability Characterization
www.ectc.net
For more information about the events above please contact us at:
Phone: +1-678-990-3320 ext. 224
Fax: +1-678-990-3324
Email: Matt.perry@engentaat.com
|
