Events
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ECTC 2011
61st ECTC | Electronic Components and Technology Conference
May 31st-June 3rd, 2011
Orlando, FL, USA
Session Chair: Session 22: Manufacturing Challenges of Wafer Thinning and Flip Chip Processing
www.ectc.net
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SMTA Tech Expos
Detroit, MI; Minneapolis, MN.
May 19th & June 9th, 2011
Paper Presented: New and Emerging Technologies in Electronics
www.smta.org
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SMTA Webinar
Feburary 15,22, 2011 1:00pm EST - 2:30pm EST
Website Event
Topic: Advanced Flip Chip Technology and Processing
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IMAPS Florida Chapter 2011 Symposium
International Microelectronics & Packaging Society
Febuary 24, 2011
Orlando, FL., USA
Paper Presented: Device Level 3D Integration Technologies for High Performance System in Package Modules
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SMTA Pan Pacific Symposium
Surface Mount Technology Association International
January 18 - 20, 2011
Big Island, Hawaii, USA
Paper Presented: Device Level 3D Integration Technologies for High Performance/Reliability Modules
http://www.smta.org/
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SMTAI 2010
Surface Mount Technology Association International
October 24 - 28, 2010
Orlando, Florida, USA
Paper Presented: Pb-free reflow process study for high yield, high reliability flip chip on silicon substrate assembly
http://www.smta.org/
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IWLPC 2010
International Wafer Level Packaging Conference
October 11 - 14, 2010
Santa Clara, CA. USA
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Tutorial: T5 - Advanced Flip Chip Technology and Processing, Daniel F. Baldwin, Ph.D., Engent, Inc.
www.iwlpc.com/smtai
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COMS 2010
60th ECTC | Electronic Components and Technology Conference
August 30 - September 4, 2010
Albequrque, New Mexico, USA
Paper Presented: 3D-WLCSP Packaging Technology for High Volume MEMS Applications
http://www.mancef.org/COMS
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ECTC 2010
60th ECTC | Electronic Components and Technology Conference
June 1-4, 2010
Las Vegas, Nevada, USA
Paper Presented: Sensitivity Analysis of Pb Free Reflow Profile Parameters Toward Flip Chip on Silicon Assembly Yield, Reliability and Intermetallic Compound Characteristics
www.ectc.net
For more information about the events above please contact us at:
Phone: +1-678-990-3320
Fax: +1-678-990-3324
CONTACT US
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