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Events

  • ECTC 2011

    61st ECTC | Electronic Components and Technology Conference
    May 31st-June 3rd, 2011
    Orlando, FL, USA

    Session Chair: Session 22: Manufacturing Challenges of Wafer Thinning and Flip Chip Processing

    www.ectc.net

  • SMTA Tech Expos

    Detroit, MI; Minneapolis, MN.
    May 19th & June 9th, 2011


    Paper Presented: New and Emerging Technologies in Electronics

    www.smta.org


  • SMTA Webinar

    Feburary 15,22, 2011 1:00pm EST - 2:30pm EST
    Website Event

    Topic: Advanced Flip Chip Technology and Processing


  • IMAPS Florida Chapter 2011 Symposium

    International Microelectronics & Packaging Society
    Febuary 24, 2011
    Orlando, FL., USA


    Paper Presented: Device Level 3D Integration Technologies for High Performance System in Package Modules

  • SMTA Pan Pacific Symposium

    Surface Mount Technology Association International
    January 18 - 20, 2011
    Big Island, Hawaii, USA


    Paper Presented: Device Level 3D Integration Technologies for High Performance/Reliability Modules

    http://www.smta.org/
  • SMTAI 2010

    Surface Mount Technology Association International
    October 24 - 28, 2010
    Orlando, Florida, USA


    Paper Presented: Pb-free reflow process study for high yield, high reliability flip chip on silicon substrate assembly

    http://www.smta.org/
  • IWLPC 2010

    International Wafer Level Packaging Conference
    October 11 - 14, 2010
    Santa Clara, CA. USA
    ,br. Tutorial: T5 - Advanced Flip Chip Technology and Processing, Daniel F. Baldwin, Ph.D., Engent, Inc.

    www.iwlpc.com/smtai
  • COMS 2010

    60th ECTC | Electronic Components and Technology Conference
    August 30 - September 4, 2010
    Albequrque, New Mexico, USA

    Paper Presented: 3D-WLCSP Packaging Technology for High Volume MEMS Applications

    http://www.mancef.org/COMS

  • ECTC 2010

    60th ECTC | Electronic Components and Technology Conference
    June 1-4, 2010
    Las Vegas, Nevada, USA

    Paper Presented: Sensitivity Analysis of Pb Free Reflow Profile Parameters Toward Flip Chip on Silicon Assembly Yield, Reliability and Intermetallic Compound Characteristics

    www.ectc.net


For more information about the events above please contact us at:

Phone: +1-678-990-3320
Fax: +1-678-990-3324
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