Engineering Services
Engent provides a variety of engineering services that allow its customers to launch new products and technologies effectively.
Packaging and Process Technology Selection and Qualification
- Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing)
- Under bump metalization specification (sputtering, evaporation, electroless plating)
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Materials Selection and Qualification
- Qualified Surface Finish Selection
- Flux Selection
- Underfill Selection
- Solder mask Selection
- Substrate Selection
- Qualified Material Systems
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Advanced Surface Mount Processing and Advanced Packaging
- SIP and Module Deployment to Low Cost Production
- Wafer level packaging DFM
- SIP / Module packaging DFM
- Integrated SIP-SMT processing
- Bare Die Handling (Si, SiGe, GaAs, InP, Lithium*)
- Substrate Selection (AlN, LTCC, HTCC, Thermount®, BT, FR-5, Polyimide, Metal Core, etc)
- Wire bonding DFM (Ball, Wedge, Ribbon)
- BGA Packaging DFM
- Gallium Alloy Interconnects, Conductors and Bonding (Flip Chip, Optical Fiber Bonding, Via Filling)
- Encapsulation Techniques
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Advanced Process Development and Deployment
- Active and Passive
- Low Temperature Si Bonding
- Passive Alignment (automated and interconnect)
- MEMS Packaging (Optical, Micro-Relays, Pres. Sensor)
- Through Wafer Conductive Vias
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Reliability Qualification
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