Engineering Services

Engineering Services

Engent provides a variety of engineering services that allow its customers to launch new products and technologies effectively.

  • Packaging and Process Technology Selection and Qualification
  • Materials Selection and Qualification
  • Advanced Surface Mount Processing and Advanced Packaging
  • Advanced Process Development and Deployment
  • Failure Mode Analysis
  • Reliability Qualification

Technology Commercialization

Electronic Printed Circuit Board Prototyping

Electronic Product Testing

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  • Capabilities
  • Services
  • Case Studies
  • Technology Papers
  • Flip Chip Assembly Process Development, Reliability Assessment And Process Characterization For Polymer Stud Grid Array-Chip Scale Package
    The Polymer Stud Grid Array (PSGA) package is a new and unique type of area array chip scale package that shows significant advantages over conventional package configurations by virtue of its high...
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  • Experimental Wetting Dynamics Study Of Eutectic And Lead-Free Solders Varying Flux, Temperature And Surface Finish Metallization
    Demands on solder bump interconnects have increased in modern electronics this is characterized by high density, small size and fine pitch devices.
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  • Technology Commercialization
    Engent provides customer support from conception through manufacturing. Our engineers employ applications that support proof of concept development, prototyping and testing to advance technology...
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  • Flip Chip Technology
    Flip chip, or C4 (controlled collapse chip connection), is a system-in-package assembly service that provides numerous benefits over other processes of interconnection. Also known as...
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  • Next Generation Engineering and Process Development
    Turnkey Next Generation Manufacturing Services Module, SIP, and Hybrid Package Production Design Layout Parts Procurement Assembly Balling Overmolding
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  • MEMS Technology and Packaging
    Engent provides advanced MEMS (micro electro mechanical systems) technology and packaging services that benefit a wide variety of applications. Designed to protect devices from environmental elements...
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  • Surface Mount Assembly and Processing
    Engent provides advanced surface mount technology (SMT) assembly services across a variety of electronic circuit applications. In modern electronic circuit manufacturing, SMT has become the ideal means...
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  • Reliability Testing
    Engent utilizes state-of-the-art electronic product testing equipment to ensure maximum product reliability and performance. Our equipment tests for shock, vibration, temperature, and...
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  • Packaging and Process Technology Selection and Qualification
    Semiconductor wafer solder bumping technologies specification (evaporation, electroplating, stencil printing) Under bump metalization specification (sputtering, evaporation, electroless plating)...
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  • Materials Selection and Qualification
    Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems...
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  • Advanced Process Development and Deployment
    Qualified Surface Finish Selection Flux Selection Underfill Selection Solder mask Selection Substrate Selection Qualified Material Systems...
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  • Electronic Failure Analysis
    Engent’s electronic failure analysis services are refined to produce the most accurate product results and develop appropriate measures to prevent the recurrence of failure. Our services combine the...
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  • Failure Analysis In Depth
    BGA Analysis and Cross-Section Problem: Determine the cause of voids that appear in BGA balls that contain a microvia beneath them. Analysis: X-ray is used to identify the quality of the solder joints and...
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  • Assembly Failure Mode Analysis
    Problem: Determine the preliminary failure mode for a manufacturer based on the attachment process being used. Analysis: X-ray is used to identify the quality of the solder joints and other possible...
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  • Flip Chip Processing Using Wafer-Applied Underfills
    Wafer-level underfill has the potential to substantially increase the implementation and usage of flip chip technology in the electronics industry.
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  • Evaluation, Optimization, And Reliability Of No-Flow Underfill Process
    The advent of no-flow fluxing underfills for Flip Chip on Board application has required a new investigation of optimal processing for increased reliability.
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  • Flux-Underfill Compatibility And Failure Mode Analysis In High Yield Flip Chip Processing
    The compatibility of flux and underfill material systems significantly contributes to the formation and growth of process-induced defects and further influences flip chip reliability.
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  • Reliability Assessment Of Flip Chip On Organic Board Using Power Cycling Techniques
    The physical failure modes are revealed by acoustic microscopy, cross sectioning and scanning electron microscopy.
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