Capabilites
Engent is ready to support you with your electronics needs from concept to volume manufacturing. Our facility is equipped with the latest equipment for manufacturing, Failure Analysis, Reliability Testing, and Process Development. We can support your requirements for technologies including, but not limited to:
-
Direct Chip Attach
- Flip Chip
- Die Attach/ Wirebond
System in Package Assembly
MEMS Packaging
|
Multi-Chip Module Assembly
Opto-Electronics
Miniaturized Passives & Resistors (0201s)
|
|
