Dr. Baldwin has been a leading expert in the microelectronics packaging industry for eight years. He was recruited by Siemens to construct and head the Advanced Assembly Technology Center of Siemens Dematic, where he served first as Director and later promoted to Vice President. He subsequently led the management buy-out efforts and formation of Engent.
Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, specializing in electronics packaging, electronics manufacturing, MEMS/MOEMS packaging, and board assembly since 1995. He is a renowned expert of electronics assembly technology, micro (opto)-electromechanical systems, (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing.
At Georgia Tech, he managed a large technology development program with over 50 employees, and raised over $10M to fund construction of the university’s state-of-the-art electronics manufacturing and MEMS/MOEMS packaging development facility.
Dr. Baldwin received his Master of Science and Doctoral degrees in Mechanical Engineering from MIT and has published or delivered over 250 articles, scholarly papers, textbooks, keynote addresses, and conference presentations. He has previously held positions at MIT as a research manager, and at Bell Labs, where his work focused on electronic product miniaturization and advanced interconnect technologies.
A handful of his many honors include: